Methods demonstrated cob led display through COB are, for example, crystal development, post retention, localization of the metal mixture within the crystal structure, retention until the colloid and crystal combination solidifies and removal, drying of the latest product or service, pre-inspection, distribution, recovery, writing an analysis to Create, which is described in detail below:
The first step: expanding the crystal, using the expansion of the entire LED wafer film to spread evenly, so that the closely arranged LED crystal grains attached to the surface of the film are pulled apart, which is conducive to stinging the crystal.
Step 2: Adhesive, while scraping off the metal paste, creates a widened crystal engagement ring on the outside of the sticky device and coats the metal compound. Good for large quantities of indicated potato chips. Use a glue dispenser to provide the PCB's printed circuit table with the appropriate level of metal mix.
The third step: inject the prepared metal paste for crystal expansion into the whole body of the crystal thorn, and the user will use the crystal thorn pencil to pierce the LED notch on the brand circuit board of the PCB under the microscope.
The fourth stage: put the punched PCB printed circuit board in a thermal cycle oven for a period of time at a constant temperature, continue the temperature, and observe whether it is cured and removed (do not leave it for a long time, otherwise the conductive chip is likely to be cooked when covered discoloration, i.e.: oxidation, can cause connection problems). If you have Guided nick connections you need to do these strategies or IC mark connections, you can actually end up with those methods.
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